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The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices.

For the purpose of this standard, the term “devices” includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.

 

ENVIRONMENTAL TESTS

  • 1001 Barometric pressure, reduced (altitude operation)
  • 1002 Immersion
  • 1003 Insulation resistance
  • 1004.7 Moisture resistance
  • 1005.11 Steady state life
  • 1006 Intermittent life
  • 1007.1 Agree life
  • 1008.2 Stabilization bake
  • 1009.8 Salt atmosphere (corrosion)
  • 1010.9 Temperature cycling
  • 1011.9 Thermal shock
  • 1012.1 Thermal characteristics
  • 1013 Dew point
  • 1014.17 Seal
  • 1015.12 Burn-in test
  • 1016.2 Life/reliability characterization tests
  • 1017.3 Neutron irradiation
  • 1018.10 Internal gas analysis
  • 1019.9 Ionizing radiation (total dose) test procedure
  • 1020.1 Dose rate induced latchup test procedure
  • 1021.3 Dose rate upset testing of digital microcircuits
  • 1022 Mosfet threshold voltage
  • 1023.3 Dose rate response of linear microcircuits
  • 1030.2 Preseal burn-in
  • 1031 Thin film corrosion test
  • 1032.1 Package induced soft error test procedure (due to alpha particles)
  • 1033 Endurance life test
  • 1034.2 Die penetrant test (for plastic devices)

Electrical tests (digital), methods 3001-3024

  • 3001.1 Drive source, dynamic
  • 3002.1 Load conditions
  • 3003.1 Delay measurements
  • 3004.1 Transition time measurements
  • 3005.1 Power supply current
  • 3006.1 High level output voltage
  • 3007.1 Low level output voltage
  • 3008.1 Breakdown voltage, input or output
  • 3009.1 Input current, low level
  • 3010.1 Input current, high level
  • 3011.1 Output short circuit current
  • 3012.1 Terminal capacitance
  • 3013.1 Noise margin measurements for digital microelectronic devices
  • 3014 Functional testing
  • 3015.8 Electrostatic discharge sensitivity classification
  • 3016 Activation time verification
  • 3017 Microelectronics package digital signal transmission
  • 3018 Crosstalk measurements for digital microelectronic device packages
  • 3019.1 Ground and power supply impedance measurements for digital microelectronics device packages
  • 3020 High impedance (off-state) low-level output leakage current
  • 3021 High impedance (off-state) high-level output leakage current
  • 3022 Input clamp voltage
  • 3023.1 Static latch-up measurements for digital CMOS microelectronic devices
  • 3024 Simultaneous switching noise measurements for digital microelectronic devices